Thermal Putty 14.8 W/mK Non-Conductive High-Performance Gap Filler 50g

Product Description

Thermal Putty 14.8 W/mK by PolarTronix is a high-performance, non-conductive thermal gap filler designed for electronics cooling and repair applications. Its soft, moldable consistency conforms to uneven surfaces and different component heights, helping create thermal contact between heat-generating components and cooling hardware.

This Thermal Putty 14.8 W/mK is suitable for compatible VRAM, VRMs, MOSFETs, coils, power components and other areas where a variable thermal gap needs to be filled. Unlike fixed-thickness thermal pads, the moldable putty can conform to irregular clearances when the heatsink is installed.

The PolarTronix thermal putty comes in a 50 g jar and is designed for use in laptops, graphics cards, gaming PCs, PS5, Xbox Series X/S, mini PCs and other compatible electronics cooling applications.

Applications

• Laptop GPU and motherboard cooling
• Graphics card VRAM
• VRM components
• MOSFETs and power stages
• Coils and inductors
• Gaming laptops
• Desktop GPUs
• PlayStation 5
• Xbox Series X / Series S
• Mini PCs
• Compatible electronics repair applications

Product Specifications

• Product Type: Thermal Putty / Thermal Gap Filler
• Brand: PolarTronix
• Thermal Conductivity: 14.8 W/m·K
• Net Weight: 50 g
• Electrical Property: Non-Conductive
• Material Format: Soft, moldable and compressible
• Color: Gray
• Application: Variable and irregular thermal gaps
• Suitable For: VRAM, VRM, MOSFETs, coils, GPUs, laptops and compatible electronics
• Package: 50 g Thermal Putty Jar

Warranty Details

Warranty: 1 Month Warranty
Warranty Service Type: Replacement Warranty
Warranty Type: Seller Warranty

Important Note:-

• Use Thermal Putty 14.8 W/mK only where a thermal gap-filling material is appropriate for the device’s original cooling design.
• Thermal putty should not automatically replace every thermal pad or thermal paste. Check the required thermal interface and gap before application.
• Apply enough material to establish proper contact; do not use excessive putty.
• The heatsink should seat normally after application. Do not force the heatsink closed against excessive material.
• Avoid spreading the putty over unrelated PCB areas, connectors, mounting points or other areas where it is not required.
• The product is electrically non-conductive, but correct application and proper assembly are still important.
• Product images are for reference only. Actual packaging, labeling and appearance may vary.
• Keep the container properly closed when not in use and follow appropriate storage and handling practices.
• Professional application is recommended for expensive GPUs, laptops and gaming consoles.
• If the product is found to be out of stock after ordering, the payment will be refunded.
• Functionality-related problems with the supplied product reported within the warranty period are eligible for replacement according to warranty terms.

FAQs

1. What is Thermal Putty 14.8 W/mK used for?

Thermal Putty 14.8 W/mK is used as a moldable thermal gap filler between compatible heat-generating components and cooling hardware, especially where component heights or gaps are uneven.

2. Is this thermal putty electrically conductive?

No. The PolarTronix thermal putty is specified as non-conductive, making it suitable for use around compatible electronic components when properly applied.

3. Can this thermal putty be used on laptop GPUs?

Yes. It is designed for compatible laptop cooling applications, including variable thermal gaps around components such as VRAM, VRMs and MOSFETs.

4. Can I use this thermal putty on PS5 and Xbox Series X/S?

Yes. PolarTronix specifically lists PS5 and Xbox Series X/S among its compatible device applications.

5. How much thermal putty is included?

The product contains 50 grams of thermal putty in a jar, suitable for multiple compatible repair and thermal-management applications.